8102306CA - Texas Instruments
Compare product
In Stock: 108
Latest price$5.89
Shipping
Package
Shipping Cost
- 1. Shipping starts at $40, but prices may vary for certain countries like South Africa, Brazil, India, Pakistan, Israel, etc.
- 2. The basic freight for packages ≤0.5kg or equivalent volume is influenced by the time zone and country.
Shipping Method
- 1. Our products are currently shipped using DHL, SF, and UPS. For low quantities, FedEx is the chosen carrier.
Delivery Time
- 1. Once shipped, the estimated delivery time is contingent on the selected shipping method.
Related Products
| Mfr Part # | Price ($) | Quantity Available | Compare product |
|---|---|---|---|
 | $0.03 | 4664 | Compare |
Popular products from the same brand
View All Product from Texas Instruments
OPA2227U
Texas Instruments
IC OPAMP GP 2 CIRCUIT 8SOIC
AMC1300BDWVR
Texas Instruments
IC ISOLATION 8SOIC
LM293DR
Texas Instruments
IC COMPARATOR 2 DIFF 8SOIC
LM393DGKR
Texas Instruments
IC COMPARATOR 2 DIFF 8VSSOP
LM2901PWR
Texas Instruments
IC COMPARATOR 4 DIFF 14TSSOP
SN74LVC1G17DCKR
Texas Instruments
IC BUF NON-INVERT 5.5V SC70-5
SN74LVC2G17MDCKREP
Texas Instruments
IC BUF NON-INVERT 5.5V SC70-6
CD40106BM96
Texas Instruments
IC INV SCHMITT 6CH 1-IN 14SOIC
SN74LVC1G06DCKR
Texas Instruments
IC BUFFER INVERT 5.5V SC70-5
TS3DV642A0RUAR
Texas Instruments
IC MUX/DEMUX 12 X 2:1 42WQFN
SN74HC157PWR
Texas Instruments
IC MULTIPLEXER 4 X 2:1 16TSSOP
PCA9306DQER
Texas Instruments
IC TRANSLTR BIDIRECTIONAL 8X2SON
SN74LVC4245ADWR
Texas Instruments
IC TRANSLTR BIDIRECTIONAL 24SOIC
BQ25890RTWR
Texas Instruments
IC BATT CHG LI-ION 1CELL 24WQFN
BQ24170RGYR
Texas Instruments
IC BATT CHG LI-ION 1-3CEL 24VQFN
Product Attributes
Select allPackage: Bulk
Product Status: Active
Amplifier Type: J-FET
Number of Circuits: 4
Slew Rate: 13V/µs
Gain Bandwidth Product: 3 MHz
Current - Input Bias: 65 pA
Voltage - Input Offset: 3 mV
Current - Supply: 1.4mA (x4 Channels)
Voltage - Supply Span (Min): 10 V
Voltage - Supply Span (Max): 30 V
Operating Temperature: -55°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 14-CDIP (0.300", 7.62mm)
Supplier Device Package: 14-CDIP
In Stock: 108
Latest price$5.89
Hot Products on the Dedicate
INA241A1IDR
Texas Instruments
-5-V TO 110-V BIDIRECTIONAL ULTR
INA296A4IDR
Texas Instruments
-5-V TO 110-V, BIDIRECTIONAL, 1.
INA241A1QDGKRQ1
Texas Instruments
AEC-Q100, -4-V TO 110-V BIDIRECT
INA241A4QDGKRQ1
Texas Instruments
AEC-Q100, -4-V TO 110-V BIDIRECT
INA241A2QDGKRQ1
Texas Instruments
AEC-Q100, -4-V TO 110-V BIDIRECT
INA241A3IDR
Texas Instruments
-5-V TO 110-V BIDIRECTIONAL ULTR
LMH6732MA/NOPB
Texas Instruments
IC OPAMP CFA 1 CIRCUIT 8SOIC
LM324BAIPWR
Texas Instruments
IC
LM2902BAIPWR
Texas Instruments
IC
INA181A3QDCKRQ1
Texas Instruments
AEC-Q100, 26V, BI-DIRECTIONAL, 3
Popular Manufacturers
Dedicate Market Insights
Shortage Procurement: How Dedicate can support you
The COVID-19 pandemic has brought huge changes to people's lifestyles, with travel taking a back seat as the masses retreat to their homes. At the same time, the demand for consumer electronics has also increased significantly to meet the needs of people working and studying at home. The continuous development of technological innovation has only intensified the demand for complex electronic equipment.
Explore the power of Nvidia H200 for AI model training
Explore the cutting-edge possibilities of AI training with Nvidia's H200 chip. Unlock the ultimate potential of your AI models and revolutionize your work.
An in-depth look at the global ceramic capacitor market
Join us to explore the latest trends in the global ceramic capacitor market.
Infineon acquires 3db Access AG
Infineon Technologies AG acquired 3db Access AG on October 4, 2023, marking a major move for the technology industry.
TI selects Lehi, Utah, for cutting-edge semiconductor center
Texas Instruments Incorporated (TI) has selected Lehi, Utah as the site for its upcoming 300mm semiconductor wafer fab (fab).
Renesas Electronics' Balaji Kanigicherla talks in-memory computing for artificial intelligence
Balaji Kanigicherla, vice president and general manager of the Advanced Mixed Signal and ASIC Solutions Group at Renesas Electronics Corporation, emphasized the need to bridge the gap between memory and computing in the technology industry. This gap refers to the difference between computing requirements (especially in artificial intelligence applications) and storage system efficiency.