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Manufacturer

  • Allegro MicroSystems
  • Analog Devices Inc.
  • Analog Devices Inc./Maxim Integrated
  • Asahi Kasei Microdevices/AKM
  • Atmel
  • Broadcom Limited
  • Cirrus Logic Inc.
  • Freescale Semiconductor
  • IDT, Integrated Device Technology Inc.
  • Infineon Technologies
  • Intersil
  • Melexis Technologies NV
  • Microchip Technology
  • National Semiconductor
  • NXP USA Inc.
  • onsemi
  • Renesas
  • Renesas Electronics America Inc.
  • STMicroelectronics
  • Texas Instruments

Series

  • *
  • -
  • AD9840
  • AD9847
  • AD9929
  • AD9995
  • Automotive, AEC-Q100
  • cLite™
  • LT®
  • QTwo™
  • TPS

Package

  • -
  • Bag
  • Box
  • Bulk
  • Cut Tape (CT)
  • Strip
  • Tape & Reel (TR)
  • Tray
  • Tube

Product Status

  • Active
  • Discontinued at
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Type

  • -
  • ADC, DAC
  • Automotive
  • Battery Management
  • Biometric Sensor Hub
  • Capacitance-to-Digital Converter
  • Capacitive Sensor
  • Capacitive Touch and Proximity Sensor
  • Capacitive Touch Screen Controller
  • CCD Signal Processor, 10-Bit
  • CCD Signal Processor, 12-Bit
  • CCD Signal Processor, 14-Bit
  • Clock Generator
  • Controller
  • Converter
  • Current Loop Protector
  • Current Transmitter
  • Data Acquisition
  • Detector Controller
  • Distance Measuring, Preamplifier
  • Distributed Systems Interface
  • Engine Knock Signal Processor
  • Front End
  • Hall Effect Sensor
  • Hall Effect Switch
  • Horn Driver
  • Hub
  • Image Sensor
  • Interface
  • Level Shifter
  • Motion Coprocessor
  • Optical
  • Output Driver
  • Piezoelectric - Strain Gauge
  • Power Management
  • Pressure Sensor
  • Programmable Amplifier/Attenuator
  • Proximity Detector
  • R/D Converter
  • Relay/Load Driver
  • Resistive
  • Sensor Conditioner
  • Sensor Interface
  • Sensor Interface - Unprogrammed
  • Sensor Interface, Signal Conditioner
  • Serializer
  • SFP Laser Controller
  • SFP+ Controller
  • Signal Conditioner
  • Signal Processor
  • Smart Sensor
  • Smoke Detector
  • Temperature Sensor
  • Thermocouple Amplifier
  • Thermocouple Conditioner
  • Thermocouple to Digital Converter
  • Time to Flight to Digital Converter
  • Touch Sensor
  • Translator
  • Variable Reluctance

Input Type

  • -
  • 4 ~ 20mA
  • Analog
  • Analog Current
  • Analog Voltage
  • Analog, Digital
  • Analog, Logic, Photodiode
  • Capacitive
  • CML
  • CMOS
  • Differential
  • Digital
  • Ionization
  • Logic
  • LVDS
  • Parallel
  • Photodiode
  • Photoelectric
  • Serial
  • Thermocouple
  • Thermocouple (J)
  • Thermocouple (K)
  • Thermocouple (Multiple)
  • Ultrasound
  • Voltage

Output Type

  • -
  • 1-Wire®
  • 1-Wire®, I2C
  • 1-Wire®, I2C, SPI
  • 1-Wire®, I²C
  • 1-Wire®, I²C, SPI
  • 2-Wire
  • 3-Wire Serial
  • 3-Wire SPI Serial
  • 4 ~ 20mA
  • 4-Wire Serial
  • Analog
  • Analog Voltage
  • Analog, Digital
  • CML
  • CMOS
  • Current
  • Differential
  • Digital
  • Digital, I²C
  • Digital, Serial
  • ISO9141
  • I²C
  • I²C, 2-Wire Serial
  • I²C, Serial
  • I²C, SPI
  • LIN
  • Logic
  • LVDS
  • Parallel
  • Serial
  • Serial, SPI
  • SPI
  • Thermocouple
  • Voltage

Operating Temperature

  • -
  • -10°C ~ 60°C
  • -10°C ~ 60°C (TA)
  • -20°C ~ 105°C (TA)
  • -20°C ~ 45°C
  • -20°C ~ 75°C
  • -20°C ~ 85°C
  • -25°C ~ 105°C (TA)
  • -25°C ~ 75°C
  • -25°C ~ 85°C
  • -40°C ~ 100°C
  • -40°C ~ 105°C
  • -40°C ~ 105°C (TA)
  • -40°C ~ 110°C
  • -40°C ~ 115°C
  • -40°C ~ 120°C
  • -40°C ~ 125°C
  • -40°C ~ 125°C (TA)
  • -40°C ~ 125°C (TJ)
  • -40°C ~ 140°C
  • -40°C ~ 150°C
  • -40°C ~ 150°C (TA)
  • -40°C ~ 85°C
  • -40°C ~ 85°C (TA)
  • -40°C ~ 90°C (TA)
  • -40°C ~ 95°C
  • -55°C ~ 125°C
  • -55°C ~ 125°C (TA)
  • -55°C ~ 150°C
  • 0°C ~ 50°C
  • 0°C ~ 60°C (TA)
  • 0°C ~ 70°C
  • 0°C ~ 70°C (TA)
  • 0°C ~ 85°C
  • 0°C ~ 90°C
  • 150°C
  • 20°C ~ 85°C
  • 25°C ~ 100°C

Mounting Type

  • -
  • Surface Mount
  • Surface Mount, Wettable Flank
  • Through Hole

Package / Case

  • -
  • 10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
  • 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • 10-VFDFN Exposed Pad
  • 10-WFDFN Exposed Pad
  • 100-LFBGA, CSPBGA
  • 105-LFBGA, CSPBGA
  • 112-LFBGA, CSPBGA
  • 12-LFLGA
  • 12-WFBGA, WLBGA
  • 12-WFDFN Exposed Pad
  • 12-WFQFN Exposed Pad
  • 12-XFBGA, DSBGA
  • 128-LFBGA, CSPBGA
  • 14-CDIP (0.300", 7.62mm)
  • 14-DIP (0.300", 7.62mm)
  • 14-SOIC (0.154", 3.90mm Width)
  • 14-SOIC (0.295", 7.50mm Width)
  • 14-SSOP (0.209", 5.30mm Width)
  • 14-TSSOP (0.173", 4.40mm Width)
  • 14-VFQFN Exposed Pad
  • 16-CDIP (0.300", 7.62mm)
  • 16-DIP (0.300", 7.62mm)
  • 16-SOIC (0.154", 3.90mm Width)
  • 16-SOIC (0.154", 3.90mm Width), 14 Leads
  • 16-SOIC (0.295", 7.50mm Width)
  • 16-SSOP (0.154", 3.90mm Width)
  • 16-SSOP (0.209", 5.30mm Width)
  • 16-TSSOP (0.173", 4.40mm Width)
  • 16-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • 16-UFBGA, WLCSP
  • 16-UFQFN Exposed Pad
  • 16-VFQFN Exposed Pad
  • 16-VQFN Exposed Pad
  • 16-VQFN Exposed Pad, CSP
  • 16-WFBGA, WLBGA
  • 16-WFQFN Exposed Pad
  • 16-WQFN Exposed Pad
  • 17-UFBGA, WLCSP
  • 196-LFBGA, CSPBGA
  • 20-CDIP (0.300", 7.62mm)
  • 20-CLCC
  • 20-LCC (J-Lead)
  • 20-PowerTSSOP (0.173", 4.40mm Width)
  • 20-SOIC (0.295", 7.50mm Width)
  • 20-SOIC (0.295", 7.50mm Width) Exposed Pad
  • 20-SSOP (0.209", 5.30mm Width)
  • 20-TSSOP (0.173", 4.40mm Width)
  • 20-VFDFN Exposed Pad
  • 20-VFQFN Exposed Pad
  • 20-VQFN Exposed Pad
  • 20-WFQFN Exposed Pad
  • 20-WFQFN Exposed Pad, CSP
  • 24-CDIP (0.600", 15.24mm)
  • 24-SOIC (0.295", 7.50mm Width)
  • 24-SSOP (0.154", 3.90mm Width)
  • 24-SSOP (0.209", 5.30mm Width)
  • 24-UFBGA, WLCSP
  • 24-VFQFN Exposed Pad
  • 24-WFQFN Exposed Pad
  • 25-TFBGA
  • 28-DIP (0.500", 12.70mm), 22 Leads
  • 28-LCC (J-Lead)
  • 28-SOIC (0.295", 7.50mm Width)
  • 28-SSOP (0.209", 5.30mm Width)
  • 28-TSSOP (0.173", 4.40mm Width)
  • 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • 28-UFQFN Exposed Pad
  • 28-VQFN Exposed Pad
  • 28-WFQFN Exposed Pad
  • 28-WFQFN Exposed Pad, CSP
  • 32-TQFP Exposed Pad
  • 32-WFQFN Exposed Pad
  • 32-WFQFN Exposed Pad, CSP
  • 33-UFBGA, WLCSP
  • 35-UFBGA, WLCSP
  • 36-UFBGA, DSBGA
  • 36-VFQFN Exposed Pad
  • 36-WFBGA, WLBGA
  • 38-DIP (0.500", 12.70mm), 8 Leads
  • 38-DIP (0.800", 20.32mm), 12 Leads
  • 38-DIP (0.800", 20.32mm), 15 Leads
  • 38-PowerTFSOP (0.173", 4.40mm Width)
  • 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
  • 38-VFLGA Module
  • 40-VFQFN Exposed Pad
  • 40-VFQFN Exposed Pad, CSP
  • 40-WFQFN Exposed Pad
  • 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
  • 44-LCC (J-Lead)
  • 44-LQFP
  • 48-LQFP
  • 48-PowerTQFP
  • 48-TQFP
  • 48-TQFP Exposed Pad
  • 48-VFQFN Exposed Pad, CSP
  • 48-WFQFN Exposed Pad, CSP
  • 49-VFBGA
  • 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • 54-SSOP (0.295", 7.50mm Width) Exposed Pad
  • 56-VFQFN Exposed Pad, CSP
  • 6-WDFN Exposed Pad
  • 64-LFBGA, CSPBGA
  • 64-LQFP
  • 64-PowerTQFP
  • 64-QFP
  • 64-VFQFN Exposed Pad, CSP
  • 68-VFQFN Exposed Pad
  • 70-LFBGA
  • 8-CDIP (0.300", 7.62mm)
  • 8-DIP (0.300", 7.62mm)
  • 8-FlipChip
  • 8-SOIC (0.154", 3.90mm Width)
  • 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • 8-UFDFN Exposed Pad
  • 8-VDFN Exposed Pad
  • 8-VFDFN Exposed Pad
  • 84-LFBGA, CSPBGA
  • 84-TFBGA
  • 84-VFQFN Dual Rows, Exposed Pad
  • 9-WFBGA, WLBGA
  • 96-LFBGA, CSPBGA
  • Die
  • Module
  • TO-205AA, TO-5-8 Metal Can

Supplier Device Package

  • -
  • 0402/SOD-923F
  • 10-HVSSOP
  • 10-MSOP
  • 10-TDFN (3x3)
  • 10-TDFN (3x4)
  • 10-uMAX
  • 10-uMAX/uSOP
  • 10-VSON (3x3)
  • 10-VSON (3x4)
  • 10-VSSOP
  • 100-CSPBGA (9x9)
  • 105-CSPBGA (8x8)
  • 112-CSPBGA (8x8)
  • 12-DIP
  • 12-DSBGA (2.45x1.7)
  • 12-LGA-CAV (2.8x5)
  • 12-PDIP
  • 12-TDFN (3x3)
  • 12-TQFN (3x3)
  • 12-WLP (2.14x1.56)
  • 12-WSON (4x4)
  • 128-CSPBGA (9x9)
  • 14-CDIP
  • 14-PDIP
  • 14-QFN (4x4)
  • 14-SO
  • 14-SOIC
  • 14-SSOP
  • 14-TSSOP
  • 16-CDIP
  • 16-CERDIP
  • 16-DIP
  • 16-LFCSP-VQ (4x4)
  • 16-PDIP
  • 16-QFN (3x3)
  • 16-QFN (4x4)
  • 16-QSOP
  • 16-SOIC
  • 16-SSOP
  • 16-TSSOP
  • 16-TSSOP-EP
  • 16-UQFN (3x3)
  • 16-WLCSP (2.46x1.4)
  • 16-WLP (1.55x1.57)
  • 16-WQFN (4x4)
  • 17-WLCSP (2.46x1.4)
  • 196-CSPBGA (12x12)
  • 20-CDIP
  • 20-CLCC (9x9)
  • 20-DFN (6x5)
  • 20-HSOIC
  • 20-HTSSOP
  • 20-LFCSP (4x4)
  • 20-MQFN (5x5)
  • 20-PLCC (9x9)
  • 20-QFN (4x4)
  • 20-SOIC
  • 20-SSOP
  • 20-TQFN (4x4)
  • 20-TSSOP
  • 20-VQFN (5x5)
  • 24-CDIP
  • 24-QFN (4x4)
  • 24-QFN (4x5)
  • 24-SO
  • 24-SOIC
  • 24-SSOP
  • 24-TQFN (3.5x3.5)
  • 24-TQFN (3x3)
  • 24-TQFN (4x4)
  • 24-VFQFPN (4x4)
  • 24-WLCSP (2.62x1.8)
  • 25-NFBGA (4x4)
  • 28-DIP
  • 28-LFCSP-WQ (4x4)
  • 28-PLCC (11.51x11.51)
  • 28-QFN (6x6)
  • 28-SOIC
  • 28-SSOP
  • 28-TQFN (5x5)
  • 28-TSSOP
  • 28-TSSOP-EP
  • 28-UQFN (4x4)
  • 32-LFCSP-WQ (5x5)
  • 32-STQFN (4x4)
  • 32-TQFN (5x5)
  • 32-TQFP (5x5)
  • 33-WLCSP (3.11x2.14)
  • 35-WLCSP (3.11x2.14)
  • 36-DSBGA (3.66x3.66)
  • 36-VQFN (6x6)
  • 36-WLP (2.57x2.57)
  • 38-HTSSOP
  • 38-OLGA (4.1x4.5)
  • 38-TSSOP-EP
  • 40-LFCSP (6x6)
  • 40-LFCSP-VQ (6x6)
  • 40-QFN (5x5)
  • 40-TQFN (5x5)
  • 40-VFQFPN (5x5)
  • 44-HSOP
  • 44-PLCC (16.59x16.59)
  • 44-TQFP (10x10)
  • 48-HTQFP (7x7)
  • 48-LFCSP (7x7)
  • 48-LFCSP-VQ (7x7)
  • 48-LFQFP (7x7)
  • 48-LQFP (7x7)
  • 48-TQFP (7x7)
  • 48-TQFP-EP (7x7)
  • 49-VFBGA (5x5)
  • 54-SOIC
  • 54-SOIC-EP
  • 56-LFCSP (8x8)
  • 56-LFCSP-VQ (8x8)
  • 6-TDFN (3x3)
  • 64-CSPBGA (9x9)
  • 64-HTQFP (10x10)
  • 64-LFCSP-VQ (9x9)
  • 64-PQFP (14x14)
  • 68-QFN (10x10)
  • 70-GQFN (6x10)
  • 8-CERDIP
  • 8-DFN (2x3)
  • 8-DFN (3x3)
  • 8-DIP
  • 8-FlipChip
  • 8-MSOP
  • 8-PDIP
  • 8-QFN (2x2)
  • 8-SO
  • 8-SOIC
  • 8-SON (3x3)
  • 8-uMAX/uSOP
  • 8-VSSOP
  • 8-µMAX
  • 84-AQFN (7x7)
  • 84-CSPBGA (12x6)
  • 84-CSPBGA (6x6)
  • 84-TFBGA (6x6)
  • 9-WLP (1.53x1.53)
  • 96-CSPBGA (8x8)
  • Die
  • Micro8™
  • Module
  • PG-DSO-14-66
  • PG-DSO-16
  • PG-DSO-16-1
  • PG-LQFP-64
  • TO-5
  • Wafer

Media

Stocking Options

Products - Record(s)

1320 Record(s)