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Products

Manufacturer

  • Analog Devices Inc.
  • Texas Instruments

Series

  • -

Package

  • Box
  • Bulk

Product Status

  • Active

Proto Board Type

  • -
  • Plated Through Hole to Plated Through Hole
  • SMD to DIP
  • SMD to Plated Through Hole
  • SMD to SMD

Package Accepted

  • -
  • DFN, MSOP, SC70, SOIC, SOT-23
  • DPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-16
  • MSOP, SC70, SOIC, SOT23, SOT563, TSSOP
  • QFN
  • SC-70, SOT-23, SOT-583, SSOP, VSSOP
  • SOIC, TSSOP

Number of Positions

  • -
  • 16
  • 6
  • 8

Pitch

  • -

Board Thickness

  • -
  • 0.063" (1.60mm)

Material

  • -
  • FR4 Epoxy Glass

Size / Dimension

  • -

Media

Stocking Options

Products - Record(s)

13 Record(s)