Texas Instruments Incorporated (TI) has selected Lehi, Utah as the site for its upcoming 300mm semiconductor wafer fab (fab). The new facility is adjacent to TI's existing 300mm semiconductor wafer fab, LFAB, and will be combined into a single facility upon completion.
TI Executive Vice President and Chief Operating Officer Haviv Ilan said that this decision is in line with their long-term manufacturing roadmap and anticipates semiconductor growth in the electronics field, especially industrial and automotive fields. The $11 billion investment is the largest in Utah’s history and will create approximately 800 direct and numerous indirect jobs, underscoring TI’s commitment to Utah. Governor Spencer Cox emphasized that TI's investment will make Utah a global semiconductor hub.
The Lehi facility was selected for its skilled talent, strong infrastructure and community support and will produce millions of analog and embedded processing chips every day . The plant is targeting LEED Gold certification, emphasizing structural efficiency and sustainability, and has a water recycling program in place that exceeds current levels. Construction will begin in the second half of 2023, with production expected to begin in 2026, helping TI expand its manufacturing capabilities and supplement capital expenditure plans for its existing fab in Texas.